- Turnkey Solution
- In order to achieve fast TAT for every step from prototype testing to mass production/supply, GAONCHIPS has established close partnerships with world-class foundries, package companies and test companies. We have completed many successful cases through our long-term strategic partnership program. We can provide total solution services from all steps (Package/Test/Q.A/Mass Production) of semiconductor process.
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- Wafer Business
- Wafer fabrication without Wafer probing
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- Known Good Die Business
- Wafer fabrication including Wafer probing
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- Turnkey Business
- Complete all fabrication (Foundry / Package / Test)
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01
Package Design Solution
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Package bump / substrate Design
High-end design ( 2.5D PKG, Interposer design ) for AI Product
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02
Package Validity check
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Thermal Simulation / Thermal solution service
Electrical ( RLC, IR Drop, S-Parameter ) Simulation
Mechanical Simulation
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03
Package Assembly solution
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Assembly Process & condition setup
Parameter optimization ( DOE )
Clean BOM composition
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01
Support for Test Solution
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From IP Test Vector Provide to ATE Test setup
Corner Characteristics Analysis for mass productivity evaluation
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02
Vector Conversion
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Test Program Development
Load Board/Probe Card Design
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03
Test Setup
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Test Setup Interface with Test House
Test Vector Debugging Support
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04
Mass Production Support
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Low Yield Analysis
Product Characterization
Test Time Optimization
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01
Customer Quality Service
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Approval Documentation (PPAP etc.)
Customer Quality Issue handling
Automotive Service Pack solution
Customer Audit support
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02
Product Qualification
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Reliability Test based on AEC-Q100 or JEDEC
Manufacture Process qualification
Supplier Certification / Regular Audit
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03
Quality Management
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Quality management system by ISO compliance
Outsourcing quality control
Nonconforming Lot handling & monitoring
Failure Analysis for Customer return & Reliability failure
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01
Signal Integrity
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Signal Integrity by channel/Transient Simulation
Signal margin Assessment by EYE diagram based on JEDEC
Providing Solutions : Off-chip design ( PKG + Board ) Optimization
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02
Power Integrity
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Power Integrity by PDN ( Power Distribution Network ) Analysis
Power Noise Assessment based on JEDEC
Providing Solutions : DECAP budgeting to reduce power noise
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01
Customer forecast management
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02
Outsourcing Capacity control ( FAB, Package, Test )
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03
Mass-Production control
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Invoice, Build Instruction, WIP monitor
Wafer / Package / Test Yield control
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04
Raw material Inventory control
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Wafer, package substrate, EMC, packing material
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05
Delivery control
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TAT, Shipping, Logistic management