News & Notices

News & Notices
[Seoul Economic] Samsung Electronics to Hold SAFE Forum 2021, 2021 2021'Strengthening the Foundry Ecosystem' (Nov 18, 2021)

Samsung Electronics to Hold SAFE Forum 2021, 2021 2021"Strengthening the Foundry Ecosystem"

Expanding the infrastructure for developing and producing high-performance infrastructure

Attention is also paid to cooperation with domestic chip design companies.


 

Lee Sang-hyun, executive vice president of Samsung Electronics, is delivering a keynote speech at the SAFE Forum 2021./Photo provided = Samsung Electronics

Samsung Electronics announced that it will strengthen its ecosystem in order to secure customers for its foundry business. It emphasized its determination to establish foundry infrastructures with its partners as a goal of number one vision for system semiconductor business in 2030.

Samsung Electronics held 'SAFE Forum' on the 18th and introduced Samsung's latest foundry technology to its customers. The forum, which marks its third anniversary this year, shared various foundry information under the theme of "Performance Platform 2.0."

Lee Sang-hyun, executive director of Samsung Electronics, who delivered the keynote speech, introduced the foundry ecosystem SAFE platform built by Samsung Poundry. Lee said, "We will take the lead in realizing the upgraded 'Performance Platform 2.0' vision."

Samsung Electronics is actively investing in foundry fields after revealing its vision of number one system semiconductor in 2030. In particular, it is trying to secure customers through solid cooperation with its partners in all areas of foundry such as electronic design automation (EDA), cloud, Intellectual Property (IP), and package solutions on SAFE platforms.


By Reporter Kang Hae-ryeong

https://www.sedaily.com/NewsView/22U2D66R0X  


2021 Samsung Foundry SAFE Virtual Forum 

-. Partner Pavilion

* GAONCHIPS Booth / Sales Team

-. Partner Session

* GAONCHIPS Presentation / Q.A Team Ji-ho Kim

  - Presentation Title : The importance of Signal  Power Integrity Analysis at off-chip design scope