Technical Solution

Turnkey Solution
Turnkey Solution
가온칩스는 시제품 Test부터 양산 생산/공급까지 빠른 TAT를 달성하기 위하여
세계 최고의 Foundry, PKG, Test 기업과 긴밀한 파트너십을 구축하고 있습니다.
장기적이고 전략적인 파트너십 프로그램으로 업계 최고 grade의 공정 및 PKG / Test 기술의
성공적인 case study를 쌓음으로써 고객에게 PKG / Test / Q.A / Mass Production
전체 Process에 걸쳐 Total Solution을 제공합니다.
  • Wafer Business
    Wafer fabrication without Wafer probing
  • Known Good Die Business
    Wafer fabrication including Wafer probing
  • Turnkey Business
    Complete all fabrication (Foundry / Package / Test)
Packaging
01

Package Design Solution

Package bump / substrate Design

High-end design ( 2.5D PKG, Interposer design ) for AI Product

02

Package Validity check

Thermal Simulation / Thermal solution service

Electrical ( RLC, IR Drop, S-Parameter ) Simulation

Mechanical Simulation

03

Package Assembly solution

Assembly Process & condition setup

Parameter optimization ( DOE )

Clean BOM composition

Test Service
01

Support for Full Turn Key Test Solution

From IP Test Vector Provide to ATE Test setup

02

Vector Conversion

Load Board/Probe Card Design

Test Program Development

03

Test Setup

Test Setup Interface with Test House

Test Vector Debugging Support

04

Mass Production Support

Low Yield Analysis

Product Characterization

Test Time Optimization

Failure Analysis

Quality Assurance
01

Customer Quality Service

Approval Documentation

Customer Quality Issue handling

Automotive Service Pack solution

Customer Audit support

02

Product Qualification

Reliability Test based on AEC-Q100 or JEDEC

Manufacture Process qualification

Supplier Certification / Regular Audit

03

Quality Management

Quality management system by ISO compliance

Outsourcing quality control

Nonconforming Lot handling & monitoring

Failure Analysis for Customer return & Reliability failure

Off-Chip PI/SI Service
01

Signal Integrity

SI Simulation service for Memory & High Speed IO Interface

Off-chip area design methodology

Signal EYE Mask assessment based on JEDEC

02

Power Integrity

Impedance characteristic for Off-chip area

DCAP Optimization for Power Noise minimization

PDN(Power Delivery Network) budgeting

Mass Production Support
01

Customer forecast management

02

Outsourcing Capacity control ( FAB, Package, Test )

03

Mass-Production control

Invoice, Build Instruction, WIP monitor

Wafer / Package / Test Yield control

04

Raw material Inventory control

Wafer, package substrate, EMC, packing material

05

Delivery control

TAT, Shipping, Logistic management