GAONCHIPS announced the signing of an IP Access (IPA) program agreement with Cadence, reinforcing its strategic collaboration in the semiconductor IP sector. This partnership grants GAONCHIPS access to Cadence’s latest Memory and SerDes/Chiplet Interface IP, enabling in-depth analysis and technology adoption to enhance its design capabilities for next-generation AI, HPC, and automotive semiconductors.
Leveraging advanced IP and design expertise is critical for developing increasingly complex semiconductors, making such investments a key driver of competitiveness. GAONCHIPS’ proactive approach fosters a virtuous cycle—accelerating technology adoption, expanding business opportunities, and ultimately securing new customer projects.
Demonstrating its global competitiveness, GAONCHIPS has successfully secured a 2nm HPC project from an overseas customer. The company is actively expanding into Japan and North America, with plans to further penetrate key markets in Europe.
Seo Byung-Hoon, President of Cadence Korea, stated, “This IPA partnership will provide GAONCHIPS and fabless customers with greater access to Cadence’s latest IP, supporting their success.” GAONCHIPS CEO Jung Kyu-Dong added, “Through close collaboration with Cadence, we will provide comprehensive support to help our customers accelerate the development of competitive SoCs.”
This partnership is expected to further strengthen GAONCHIPS’ position in the advanced semiconductor market and accelerate its global expansion.