- Turnkey Solution
- In order to achieve fast TAT for every step from prototype testing to mass production/supply, GAONCHIPS has established close partnerships with world-class foundries, package companies and test companies. We have completed many successful cases through our long-term strategic partnership program. We can provide total solution services from all steps (Package/Test/Q.A/Mass Production) of semiconductor process.
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- Wafer Business
- Wafer fabrication without Wafer probing
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- Known Good Die Business
- Wafer fabrication including Wafer probing
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- Turnkey Business
- Complete all fabrication (Foundry / Package / Test)
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01
Package Design Solution
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Package Bump/Substrate Design
High-End Design (2.5D/3D PKG, Interposer Design) for AI/HPC Products
High-Reliability Packaging Solutions for Automotive Applications
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02
Package Validity Check
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Thermal Simulation/Thermal Solution Service
Electrical (RLC, IR Drop, S-Parameter) Simulation
Mechanical Simulation
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03
Package Assembly Solution
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Assembly Process & Condition Setup
Parameter Optimization (DOE)
Clean BOM Composition
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01
Signal Integrity
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Signal Integrity by Channel/Transient Simulation
Signal Margin Assessment by EYE Diagram
Providing Solutions: Off-Chip Design (PKG+Board) Optimization
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02
Power Integrity
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Power Integrity by PDN (Power Distribution Network) Analysis
Power Noise Check & Decap (Decoupling Capacitance) Optimization
Providing Solutions: Decap Budgeting to Reduce Power Noise
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01
Support for Test Solution
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IP Test Vector Generation to ATE Test Setup
Corner Characteristics Analysis for Mass Production Evaluation
Test Program Development
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02
Test Material
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Load Board/Probe Card Design
Load Board/Probe Card Manufacturing (Outsourcing)
IC Test Socket
Test Material Maintenance
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03
Test Setup
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Test Setup Interface with Test House
Test Vector Debugging Support
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04
Mass Production Support
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Low Yield Analysis
Product Characterization
Test Time Optimization
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01
Yield Enhancement
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Continuous Yield Trend Monitoring & Analysis
Yield Stabilization
Corner Test, Process Sweet Spot Identification
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02
Mass-Production Control
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Customer Forecast Management
Outsourcing Capacity Control (FAB, Package, Test)
Invoice, Build Instruction, WIP Monitor
Wafer/Package/Test Yield Control
Risk Management
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03
Raw Material Inventory Control
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Wafer, Package Substrate, EMC, Packing Material
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04
Delivery Control
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TAT, Shipping, Logistic Management
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01
Customer Quality Service
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Approval Documentation (PPAP etc.)
Customer Quality Issue Handling
Automotive Service Pack Solution
Customer Audit Support
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02
Product Qualification
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Reliability Test based on AEC-Q100 or JEDEC
Manufacture Process Qualification
Supplier Certification/Regular Audit
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02
Quality Management
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Quality Management System by ISO Compliance
Outsourcing Quality Control
Nonconforming Lot Handling & Monitoring
Failure Analysis for Customer Return & Reliability Failure